Yield Improvement and Test Cost Optimization for 3D Stacked ICs

Publication TypeConference Paper
TitleYield Improvement and Test Cost Optimization for 3D Stacked ICs
Author(s)S. Hamdioui
M. Taouil
Publication DateNovember 2011
Conference Name20th Asian Test Symposium
Period20-23 November 2011
LocationNew Delhi, India
ISBNt.b.s.
Page Numbers
publishedPublished
Selected PublicationNo
Note
Topic(s)None
Theme(s)None
Project(s)None
Group(s)Computer Engineering

IEEE BibTex entry:
@inproceedings{,
author = "S. Hamdioui and M. Taouil",
title = "Yield Improvement and Test Cost Optimization for 3D Stacked ICs",
booktitle = "Proc. 20th Asian Test Symposium",
address = "New Delhi, India",
month = "November",
year = "2011",
pages = ""
}