System and Circuit Level Power Modeling of Energy-Efficient 3D-Stacked Wide I/O DRAMs 1323_system_and_circuit_level_power_modeling_of_energyefficient.pdf

Publication TypeConference Paper
TitleSystem and Circuit Level Power Modeling of Energy-Efficient 3D-Stacked Wide I/O DRAMs
Author(s)K. Chandrasekar
C. Weis
B. Akesson
N. Wehn
K.G.W. Goossens
Publication DateMarch 2013
Conference NameDesign, Automation & Test in Europe Conference & Exhibition
Period18-22 March 2013
LocationGrenoble, France
ISBNt.b.a
Page Numbers
publishedPublished
Selected PublicationNo
Note
Topic(s)3D Stacking
Theme(s)None
Project(s)COMCAS
Group(s)Computer Engineering

IEEE BibTex entry:
@inproceedings{,
author = "K. Chandrasekar and C. Weis and B. Akesson and N. Wehn and K.G.W. Goossens",
title = "System and Circuit Level Power Modeling of Energy-Efficient 3D-Stacked Wide I/O DRAMs",
booktitle = "Proc. Design, Automation & Test in Europe Conference & Exhibition",
address = "Grenoble, France",
month = "March",
year = "2013",
pages = ""
}