Computer Engineering Publications Database (2000-2018) Is TSV-based 3D Integration Suitable for Inter-die Memory Repair? 
| Publication Type | Conference Paper |
|---|---|
| Title | Is TSV-based 3D Integration Suitable for Inter-die Memory Repair? |
| Author(s) | M. Lefter G.R. Voicu M. Taouil M. Enachescu S. Hamdioui S.D. Cotofana |
| Publication Date | March 2013 |
| Conference Name | Design, Automation & Test in Europe Conference & Exhibition |
| Period | 18-22 March 2013 |
| Location | Grenoble, France |
| ISBN | 0 |
| Page Numbers | |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | 3D Stacking |
| Theme(s) | None |
| Project(s) | 3DIM3 |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "M. Lefter and G.R. Voicu and M. Taouil and M. Enachescu and S. Hamdioui and S.D. Cotofana",
title = "Is TSV-based 3D Integration Suitable for Inter-die Memory Repair?",
booktitle = "Proc. Design, Automation & Test in Europe Conference & Exhibition",
address = "Grenoble, France",
month = "March",
year = "2013",
pages = ""
}
author = "M. Lefter and G.R. Voicu and M. Taouil and M. Enachescu and S. Hamdioui and S.D. Cotofana",
title = "Is TSV-based 3D Integration Suitable for Inter-die Memory Repair?",
booktitle = "Proc. Design, Automation & Test in Europe Conference & Exhibition",
address = "Grenoble, France",
month = "March",
year = "2013",
pages = ""
}