Computer Engineering Publications Database (2000-2018) Yield Improvement for 3D Wafer-to-Wafer Stacked Memories 
| Publication Type | Journal Paper |
|---|---|
| Title | Yield Improvement for 3D Wafer-to-Wafer Stacked Memories |
| Author(s) | M. Taouil S. Hamdioui |
| Publication Date | August 2012 |
| Journal Name | Journal of Electronic Testing: Theory and Applications |
| Volume | 28 |
| Issue | 4 |
| Page Numbers | 523-534 |
| ISSN | 0923-8174 |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | 3D Stacking |
| Theme(s) | Dependable Nano Computing |
| Project(s) | 3DIM3 |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@article{,
author = "M. Taouil and S. Hamdioui",
title = "Yield Improvement for 3D Wafer-to-Wafer Stacked Memories",
journal = "Journal of Electronic Testing: Theory and Applications",
volume = "28 ",
issue = "4",
month = "August",
year = "2012",
pages = "523-534"
}
author = "M. Taouil and S. Hamdioui",
title = "Yield Improvement for 3D Wafer-to-Wafer Stacked Memories",
journal = "Journal of Electronic Testing: Theory and Applications",
volume = "28 ",
issue = "4",
month = "August",
year = "2012",
pages = "523-534"
}