Interconnect Test for 3D Stacked Memories

Publication TypeMsc Thesis
TitleInterconnect Test for 3D Stacked Memories
Author(s)M. Masadeh
Advisor(s)S. Hamdioui
Publication DateAugust 2013
CE Thesis NumberCE-MS-2013-06
Selected PublicationNo
Note
Topic(s)3D Stacking
Theme(s)Dependable Nano Computing
Project(s)None
Group(s)Computer Engineering

IEEE BibTex entry:
@mastersthesis{,
author = "M. Masadeh",
title = "Interconnect Test for 3D Stacked Memories",
school = "Delft University of Technology",
address = "Delft, Netherlands",
month = "August",
year = "2013"
}