Computer Engineering Publications Database (2000-2018) Interconnect Test for 3D Stacked Memory-on-Logic
| Publication Type | Conference Proceedings |
|---|---|
| Title | Interconnect Test for 3D Stacked Memory-on-Logic |
| Author(s) | M. Taouil M. Masadeh S. Hamdioui E.J. Marinissen |
| Publication Date | March 2014 |
| Conference Name | Design, Automation & Test in Europe |
| Period | 24-28 March 2014 |
| Location | Dresden, Germany |
| ISBN | 9783981537024 |
| Editor(s) | |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | 3D Stacking |
| Theme(s) | Dependable Nano Computing |
| Project(s) | 3DIM3 |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@proceedings{,
author = "M. Taouil and M. Masadeh and S. Hamdioui and E.J. Marinissen",
title = "Interconnect Test for 3D Stacked Memory-on-Logic",
conference = "Design, Automation & Test in Europe",
address = "Dresden, Germany",
month = "March",
year = "2014",
editors = ""
}
author = "M. Taouil and M. Masadeh and S. Hamdioui and E.J. Marinissen",
title = "Interconnect Test for 3D Stacked Memory-on-Logic",
conference = "Design, Automation & Test in Europe",
address = "Dresden, Germany",
month = "March",
year = "2014",
editors = ""
}