Computer Engineering Publications Database (2000-2018) Quality versus Cost Analysis for 3D Stacked ICs
| Publication Type | Conference Proceedings |
|---|---|
| Title | Quality versus Cost Analysis for 3D Stacked ICs |
| Author(s) | M. Taouil S. Hamdioui E.J. Marinissen S Bhawmik |
| Publication Date | April 2014 |
| Conference Name | 32nd IEEE VLSI Test Symposium |
| Period | 13-17 April 2014 |
| Location | Napa, USA |
| ISBN | 9781479926114 |
| Editor(s) | |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | 3D Stacking |
| Theme(s) | Dependable Nano Computing |
| Project(s) | 3DIM3 |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@proceedings{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen and S Bhawmik",
title = "Quality versus Cost Analysis for 3D Stacked ICs",
conference = "32nd IEEE VLSI Test Symposium ",
address = "Napa, USA",
month = "April",
year = "2014",
editors = ""
}
author = "M. Taouil and S. Hamdioui and E.J. Marinissen and S Bhawmik",
title = "Quality versus Cost Analysis for 3D Stacked ICs",
conference = "32nd IEEE VLSI Test Symposium ",
address = "Napa, USA",
month = "April",
year = "2014",
editors = ""
}