Quality versus Cost Analysis for 3D Stacked ICs

Publication TypeConference Proceedings
TitleQuality versus Cost Analysis for 3D Stacked ICs
Author(s)M. Taouil
S. Hamdioui
E.J. Marinissen
S Bhawmik
Publication DateApril 2014
Conference Name32nd IEEE VLSI Test Symposium
Period13-17 April 2014
LocationNapa, USA
ISBN9781479926114
Editor(s)
publishedPublished
Selected PublicationNo
Note
Topic(s)3D Stacking
Theme(s)Dependable Nano Computing
Project(s)3DIM3
Group(s)Computer Engineering

IEEE BibTex entry:
@proceedings{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen and S Bhawmik",
title = "Quality versus Cost Analysis for 3D Stacked ICs",
conference = "32nd IEEE VLSI Test Symposium ",
address = "Napa, USA",
month = "April",
year = "2014",
editors = ""
}