Computer Engineering Publications Database (2000-2018) Post-Bond Interconnect Test and Diagnosis for 3D Memory Stacked on Logic
| Publication Type | Journal Paper |
|---|---|
| Title | Post-Bond Interconnect Test and Diagnosis for 3D Memory Stacked on Logic |
| Author(s) | M. Taouil M. Masadeh S. Hamdioui E.J. Marinissen |
| Publication Date | May 2015 |
| Journal Name | IEEE Transactions on Computers |
| Volume | |
| Issue | 99 |
| Page Numbers | 13 |
| ISSN | 0018-9340 |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | 3D Stacking |
| Theme(s) | Dependable Nano Computing |
| Project(s) | 3DIM3 |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@article{,
author = "M. Taouil and M. Masadeh and S. Hamdioui and E.J. Marinissen",
title = "Post-Bond Interconnect Test and Diagnosis for 3D Memory Stacked on Logic",
journal = "IEEE Transactions on Computers",
volume = "",
issue = "99",
month = "May",
year = "2015",
pages = "13"
}
author = "M. Taouil and M. Masadeh and S. Hamdioui and E.J. Marinissen",
title = "Post-Bond Interconnect Test and Diagnosis for 3D Memory Stacked on Logic",
journal = "IEEE Transactions on Computers",
volume = "",
issue = "99",
month = "May",
year = "2015",
pages = "13"
}