Yield Improvement for 3D Wafer-to-Wafer Stacked ICs Using Wafer Matching

Publication TypeJournal Paper
TitleYield Improvement for 3D Wafer-to-Wafer Stacked ICs Using Wafer Matching
Author(s)M. Taouil
S. Hamdioui
E.J. Marinissen
Publication DateJune 2015
Journal NameACM Transactions on Design Automation of Electronic Systems
Volume20
Issue2
Page Numbers1-23
ISSN1084-4309
publishedPublished
Selected PublicationNo
Note
Topic(s)3D Stacking
Theme(s)Dependable Nano Computing
Project(s)3DIM3
Group(s)Computer Engineering

IEEE BibTex entry:
@article{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "Yield Improvement for 3D Wafer-to-Wafer Stacked ICs Using Wafer Matching",
journal = "ACM Transactions on Design Automation of Electronic Systems",
volume = "20",
issue = "2",
month = "June",
year = "2015",
pages = "1-23"
}