Computer Engineering Publications Database (2000-2018) Yield Improvement for 3D Wafer-to-Wafer Stacked ICs Using Wafer Matching
| Publication Type | Journal Paper |
|---|---|
| Title | Yield Improvement for 3D Wafer-to-Wafer Stacked ICs Using Wafer Matching |
| Author(s) | M. Taouil S. Hamdioui E.J. Marinissen |
| Publication Date | June 2015 |
| Journal Name | ACM Transactions on Design Automation of Electronic Systems |
| Volume | 20 |
| Issue | 2 |
| Page Numbers | 1-23 |
| ISSN | 1084-4309 |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | 3D Stacking |
| Theme(s) | Dependable Nano Computing |
| Project(s) | 3DIM3 |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@article{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "Yield Improvement for 3D Wafer-to-Wafer Stacked ICs Using Wafer Matching",
journal = "ACM Transactions on Design Automation of Electronic Systems",
volume = "20",
issue = "2",
month = "June",
year = "2015",
pages = "1-23"
}
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "Yield Improvement for 3D Wafer-to-Wafer Stacked ICs Using Wafer Matching",
journal = "ACM Transactions on Design Automation of Electronic Systems",
volume = "20",
issue = "2",
month = "June",
year = "2015",
pages = "1-23"
}