Test Cost Modeling for 3D-Stacked ICs

Publication TypeConference Paper
TitleTest Cost Modeling for 3D-Stacked ICs
Author(s)M. Taouil
S. Hamdioui
E.J. Marinissen
Publication DateSeptember 2011
Conference NameSecond IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits
Period22-23 September 2011
LocationAnaheim, USA
ISBNt.b.s.
Page Numbers
publishedPublished
Selected PublicationNo
Note
Topic(s)None
Theme(s)None
Project(s)None
Group(s)Computer Engineering

IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "Test Cost Modeling for 3D-Stacked ICs",
booktitle = "Proc. Second IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits",
address = "Anaheim, USA",
month = "September",
year = "2011",
pages = ""
}