Test-architecture optimization for TSV-based 3D stacked ICs
Publication Type | Conference Paper |
---|---|
Title | Test-architecture optimization for TSV-based 3D stacked ICs |
Author(s) | B. Noia S.K. Goel K. Chakrabarty E.J. Marinissen J. Verbree |
Publication Date | May 2010 |
Conference Name | 15th IEEE European Test Symposium |
Period | 25-28 May 2010 |
Location | Prague, Czech Republic |
ISBN | t.b.s. |
Page Numbers | 24-29 |
published | Published |
Selected Publication | No |
Note | |
Topic(s) | None |
Theme(s) | None |
Project(s) | None |
Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "B. Noia and S.K. Goel and K. Chakrabarty and E.J. Marinissen and J. Verbree",
title = "Test-architecture optimization for TSV-based 3D stacked ICs",
booktitle = "Proc. 15th IEEE European Test Symposium",
address = "Prague, Czech Republic",
month = "May",
year = "2010",
pages = "24-29"
}
author = "B. Noia and S.K. Goel and K. Chakrabarty and E.J. Marinissen and J. Verbree",
title = "Test-architecture optimization for TSV-based 3D stacked ICs",
booktitle = "Proc. 15th IEEE European Test Symposium",
address = "Prague, Czech Republic",
month = "May",
year = "2010",
pages = "24-29"
}