Test-architecture optimization for TSV-based 3D stacked ICs

Publication TypeConference Paper
TitleTest-architecture optimization for TSV-based 3D stacked ICs
Author(s)B. Noia
S.K. Goel
K. Chakrabarty
E.J. Marinissen
J. Verbree
Publication DateMay 2010
Conference Name15th IEEE European Test Symposium
Period25-28 May 2010
LocationPrague, Czech Republic
ISBNt.b.s.
Page Numbers24-29
publishedPublished
Selected PublicationNo
Note
Topic(s)None
Theme(s)None
Project(s)None
Group(s)Computer Engineering

IEEE BibTex entry:
@inproceedings{,
author = "B. Noia and S.K. Goel and K. Chakrabarty and E.J. Marinissen and J. Verbree",
title = "Test-architecture optimization for TSV-based 3D stacked ICs",
booktitle = "Proc. 15th IEEE European Test Symposium",
address = "Prague, Czech Republic",
month = "May",
year = "2010",
pages = "24-29"
}