Computer Engineering Publications Database (2000-2018) Test Cost Analysis for 3D Die-to-Wafer Stacking 
| Publication Type | Conference Paper |
|---|---|
| Title | Test Cost Analysis for 3D Die-to-Wafer Stacking |
| Author(s) | M. Taouil S. Hamdioui E.J. Marinissen |
| Publication Date | December 2010 |
| Conference Name | 19th IEEE Asian Test Symposium |
| Period | 1-4 December 2010 |
| Location | Shanghai, China |
| ISBN | 978-0-7695-4248-5 |
| Page Numbers | |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | None |
| Theme(s) | None |
| Project(s) | None |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "Test Cost Analysis for 3D Die-to-Wafer Stacking",
booktitle = "Proc. 19th IEEE Asian Test Symposium",
address = "Shanghai, China",
month = "December",
year = "2010",
pages = ""
}
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "Test Cost Analysis for 3D Die-to-Wafer Stacking",
booktitle = "Proc. 19th IEEE Asian Test Symposium",
address = "Shanghai, China",
month = "December",
year = "2010",
pages = ""
}