Computer Engineering Publications Database (2000-2018) On Maximizing the Compound Yield for 3D Wafer-to-Wafer Stacked ICs 
| Publication Type | Conference Paper |
|---|---|
| Title | On Maximizing the Compound Yield for 3D Wafer-to-Wafer Stacked ICs |
| Author(s) | M. Taouil S. Hamdioui J. Verbree E.J. Marinissen |
| Publication Date | November 2010 |
| Conference Name | IEEE International Test Conference |
| Period | 2-4 November 2010 |
| Location | Austin, USA |
| ISBN | 978-1-4244-7206-2 |
| Page Numbers | |
| published | Published |
| Selected Publication | Yes |
| Note | |
| Topic(s) | None |
| Theme(s) | None |
| Project(s) | None |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui and J. Verbree and E.J. Marinissen",
title = "On Maximizing the Compound Yield for 3D Wafer-to-Wafer Stacked ICs",
booktitle = "Proc. IEEE International Test Conference",
address = "Austin, USA",
month = "November",
year = "2010",
pages = ""
}
author = "M. Taouil and S. Hamdioui and J. Verbree and E.J. Marinissen",
title = "On Maximizing the Compound Yield for 3D Wafer-to-Wafer Stacked ICs",
booktitle = "Proc. IEEE International Test Conference",
address = "Austin, USA",
month = "November",
year = "2010",
pages = ""
}