A structured and scalable test access architecture for TSV-based 3D stacked ICs

Publication TypeConference Paper
TitleA structured and scalable test access architecture for TSV-based 3D stacked ICs
Author(s)E.J. Marinissen
J. Verbree
M. Konijnenburg
Publication DateApril 2010
Conference Name28th IEEE VLSI Test Symposium
Period19-22 April 2010
LocationSanta Cruz, USA
ISBNt.b.s.
Page Numbers269-274
publishedPublished
Selected PublicationNo
Note
Topic(s)None
Theme(s)None
Project(s)None
Group(s)Computer Engineering

IEEE BibTex entry:
@inproceedings{,
author = "E.J. Marinissen and J. Verbree and M. Konijnenburg",
title = "A structured and scalable test access architecture for TSV-based 3D stacked ICs",
booktitle = "Proc. 28th IEEE VLSI Test Symposium",
address = "Santa Cruz, USA",
month = "April",
year = "2010",
pages = "269-274"
}