Computer Engineering Publications Database (2000-2018) A structured and scalable test access architecture for TSV-based 3D stacked ICs
| Publication Type | Conference Paper |
|---|---|
| Title | A structured and scalable test access architecture for TSV-based 3D stacked ICs |
| Author(s) | E.J. Marinissen J. Verbree M. Konijnenburg |
| Publication Date | April 2010 |
| Conference Name | 28th IEEE VLSI Test Symposium |
| Period | 19-22 April 2010 |
| Location | Santa Cruz, USA |
| ISBN | t.b.s. |
| Page Numbers | 269-274 |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | None |
| Theme(s) | None |
| Project(s) | None |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "E.J. Marinissen and J. Verbree and M. Konijnenburg",
title = "A structured and scalable test access architecture for TSV-based 3D stacked ICs",
booktitle = "Proc. 28th IEEE VLSI Test Symposium",
address = "Santa Cruz, USA",
month = "April",
year = "2010",
pages = "269-274"
}
author = "E.J. Marinissen and J. Verbree and M. Konijnenburg",
title = "A structured and scalable test access architecture for TSV-based 3D stacked ICs",
booktitle = "Proc. 28th IEEE VLSI Test Symposium",
address = "Santa Cruz, USA",
month = "April",
year = "2010",
pages = "269-274"
}