3D DfT Architecture for Pre-Bond and Post-Bond Testing

Publication TypeConference Paper
Title3D DfT Architecture for Pre-Bond and Post-Bond Testing
Author(s)E.J. Marinissen
C.C. Chi
J. Verbree
M. Konijnenburg
Publication DateNovember 2010
Conference NameIEEE International Conference on 3D System Integration
Period16-18 November 2010
LocationMunich, Germany
ISBNt.b.s.
Page Numbers1-8
publishedPublished
Selected PublicationNo
Note
Topic(s)None
Theme(s)None
Project(s)None
Group(s)Computer Engineering

IEEE BibTex entry:
@inproceedings{,
author = "E.J. Marinissen and C.C. Chi and J. Verbree and M. Konijnenburg",
title = "3D DfT Architecture for Pre-Bond and Post-Bond Testing",
booktitle = "Proc. IEEE International Conference on 3D System Integration",
address = "Munich, Germany",
month = "November",
year = "2010",
pages = "1-8"
}