3D DfT Architecture for Pre-Bond and Post-Bond Testing
Publication Type | Conference Paper |
---|---|
Title | 3D DfT Architecture for Pre-Bond and Post-Bond Testing |
Author(s) | E.J. Marinissen C.C. Chi J. Verbree M. Konijnenburg |
Publication Date | November 2010 |
Conference Name | IEEE International Conference on 3D System Integration |
Period | 16-18 November 2010 |
Location | Munich, Germany |
ISBN | t.b.s. |
Page Numbers | 1-8 |
published | Published |
Selected Publication | No |
Note | |
Topic(s) | None |
Theme(s) | None |
Project(s) | None |
Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "E.J. Marinissen and C.C. Chi and J. Verbree and M. Konijnenburg",
title = "3D DfT Architecture for Pre-Bond and Post-Bond Testing",
booktitle = "Proc. IEEE International Conference on 3D System Integration",
address = "Munich, Germany",
month = "November",
year = "2010",
pages = "1-8"
}
author = "E.J. Marinissen and C.C. Chi and J. Verbree and M. Konijnenburg",
title = "3D DfT Architecture for Pre-Bond and Post-Bond Testing",
booktitle = "Proc. IEEE International Conference on 3D System Integration",
address = "Munich, Germany",
month = "November",
year = "2010",
pages = "1-8"
}