Layer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories

Publication TypeConference Paper
TitleLayer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories
Author(s)M. Taouil
S. Hamdioui
Publication DateMay 2011
Conference Name16th IEEE European Test Symposium
Period23-27 May 2011
LocationTrondheim, Norway
ISBNt.b.s.
Page Numbers
publishedPublished
Selected PublicationNo
Note
Topic(s)None
Theme(s)None
Project(s)None
Group(s)Computer Engineering

IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui",
title = "Layer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories",
booktitle = "Proc. 16th IEEE European Test Symposium",
address = "Trondheim, Norway",
month = "May",
year = "2011",
pages = ""
}