Layer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories
Publication Type | Conference Paper |
---|---|
Title | Layer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories |
Author(s) | M. Taouil S. Hamdioui |
Publication Date | May 2011 |
Conference Name | 16th IEEE European Test Symposium |
Period | 23-27 May 2011 |
Location | Trondheim, Norway |
ISBN | t.b.s. |
Page Numbers | |
published | Published |
Selected Publication | No |
Note | |
Topic(s) | None |
Theme(s) | None |
Project(s) | None |
Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui",
title = "Layer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories",
booktitle = "Proc. 16th IEEE European Test Symposium",
address = "Trondheim, Norway",
month = "May",
year = "2011",
pages = ""
}
author = "M. Taouil and S. Hamdioui",
title = "Layer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories",
booktitle = "Proc. 16th IEEE European Test Symposium",
address = "Trondheim, Norway",
month = "May",
year = "2011",
pages = ""
}