How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?

Publication TypeConference Paper
TitleHow significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?
Author(s)M. Taouil
S. Hamdioui
E.J. Marinissen
Publication DateApril 2011
Conference Name6th International conference on Design & Technology of Integrated Systems in Nanoscale Era
Period6-8 April 2011
LocationAthens, Greece
ISBNt.b.s.
Page Numbers
publishedPublished
Selected PublicationNo
Note
Topic(s)None
Theme(s)None
Project(s)None
Group(s)Computer Engineering

IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?",
booktitle = "Proc. 6th International conference on Design & Technology of Integrated Systems in Nanoscale Era",
address = "Athens, Greece",
month = "April",
year = "2011",
pages = ""
}