Computer Engineering Publications Database (2000-2018) How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?
| Publication Type | Conference Paper |
|---|---|
| Title | How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs? |
| Author(s) | M. Taouil S. Hamdioui E.J. Marinissen |
| Publication Date | April 2011 |
| Conference Name | 6th International conference on Design & Technology of Integrated Systems in Nanoscale Era |
| Period | 6-8 April 2011 |
| Location | Athens, Greece |
| ISBN | t.b.s. |
| Page Numbers | |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | None |
| Theme(s) | None |
| Project(s) | None |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?",
booktitle = "Proc. 6th International conference on Design & Technology of Integrated Systems in Nanoscale Era",
address = "Athens, Greece",
month = "April",
year = "2011",
pages = ""
}
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?",
booktitle = "Proc. 6th International conference on Design & Technology of Integrated Systems in Nanoscale Era",
address = "Athens, Greece",
month = "April",
year = "2011",
pages = ""
}