Computer Engineering Publications Database (2000-2018) Stacking Order Impact on Overall 3D Die-to-Wafer Stacked-IC Cost
| Publication Type | Conference Paper |
|---|---|
| Title | Stacking Order Impact on Overall 3D Die-to-Wafer Stacked-IC Cost |
| Author(s) | M. Taouil S. Hamdioui |
| Publication Date | April 2011 |
| Conference Name | 14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems |
| Period | 13-14 April 2011 |
| Location | Cottbus, Germany |
| ISBN | t.b.s. |
| Page Numbers | 335-341 |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | None |
| Theme(s) | None |
| Project(s) | None |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui",
title = "Stacking Order Impact on Overall 3D Die-to-Wafer Stacked-IC Cost",
booktitle = "Proc. 14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems",
address = "Cottbus, Germany",
month = "April",
year = "2011",
pages = "335-341"
}
author = "M. Taouil and S. Hamdioui",
title = "Stacking Order Impact on Overall 3D Die-to-Wafer Stacked-IC Cost",
booktitle = "Proc. 14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems",
address = "Cottbus, Germany",
month = "April",
year = "2011",
pages = "335-341"
}