On Optimizing Test Cost for Wafer-to-Wafer 3D Stacked ICs 1296_on_optimizing_test_cost_for_wafertowafer_3d_stacked_ics.pdf

Publication TypeConference Paper
TitleOn Optimizing Test Cost for Wafer-to-Wafer 3D Stacked ICs
Author(s)M. Taouil
S. Hamdioui
Publication DateMay 2012
Conference Name7th International Conference on Design & Technology of Integrated Systems in Nanoscale Era
Period16-18 May 2012
LocationTunis, Tunisia
ISBNt.b.s.
Page Numbers
publishedPublished
Selected PublicationNo
Note
Topic(s)None
Theme(s)None
Project(s)None
Group(s)Computer Engineering

IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui",
title = "On Optimizing Test Cost for Wafer-to-Wafer 3D Stacked ICs",
booktitle = "Proc. 7th International Conference on Design & Technology of Integrated Systems in Nanoscale Era",
address = "Tunis, Tunisia",
month = "May",
year = "2012",
pages = ""
}