On Optimizing Test Cost for Wafer-to-Wafer 3D Stacked ICs
Publication Type | Conference Paper |
---|---|
Title | On Optimizing Test Cost for Wafer-to-Wafer 3D Stacked ICs |
Author(s) | M. Taouil S. Hamdioui |
Publication Date | May 2012 |
Conference Name | 7th International Conference on Design & Technology of Integrated Systems in Nanoscale Era |
Period | 16-18 May 2012 |
Location | Tunis, Tunisia |
ISBN | t.b.s. |
Page Numbers | |
published | Published |
Selected Publication | No |
Note | |
Topic(s) | None |
Theme(s) | None |
Project(s) | None |
Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui",
title = "On Optimizing Test Cost for Wafer-to-Wafer 3D Stacked ICs",
booktitle = "Proc. 7th International Conference on Design & Technology of Integrated Systems in Nanoscale Era",
address = "Tunis, Tunisia",
month = "May",
year = "2012",
pages = ""
}
author = "M. Taouil and S. Hamdioui",
title = "On Optimizing Test Cost for Wafer-to-Wafer 3D Stacked ICs",
booktitle = "Proc. 7th International Conference on Design & Technology of Integrated Systems in Nanoscale Era",
address = "Tunis, Tunisia",
month = "May",
year = "2012",
pages = ""
}