Exploring Test Opportunities for Memory and Interconnects in 3D ICs 1337_exploring_test_opportunities_for_memory_and__interconnects.pdf

Publication TypeConference Paper
TitleExploring Test Opportunities for Memory and Interconnects in 3D ICs
Author(s)M. Taouil
M. Lefter
S. Hamdioui
Publication DateDecember 2012
Conference NameInternational Design & Test Symposium
Period15-17 December 2012
LocationDoha, Qatar
ISBNunknown
Page Numbers
publishedPublished
Selected PublicationNo
Note
Topic(s)3D Stacking
Theme(s)Dependable Nano Computing
Project(s)3DIM3
Group(s)Computer Engineering

IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and M. Lefter and S. Hamdioui",
title = "Exploring Test Opportunities for Memory and Interconnects in 3D ICs",
booktitle = "Proc. International Design & Test Symposium",
address = "Doha, Qatar",
month = "December",
year = "2012",
pages = ""
}