3D-COSTAR: A Cost Model For 3D Stacked ICs 1339_3dcostar_a_cost_model_for_3d_stacked_ics.pdf

Publication TypeConference Proceedings
Title3D-COSTAR: A Cost Model For 3D Stacked ICs
Author(s)M. Taouil
S. Hamdioui
E.J. Marinissen
S Bhawmik
Publication DateNovember 2012
Conference NameThird IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits
Period8-9 November 2012
LocationAnaheim, USA
ISBNunknown
Editor(s)
publishedPublished
Selected PublicationNo
Note
Topic(s)3D Stacking
Theme(s)Dependable Nano Computing
Project(s)3DIM3
Group(s)Computer Engineering

IEEE BibTex entry:
@proceedings{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen and S Bhawmik",
title = "3D-COSTAR: A Cost Model For 3D Stacked ICs",
conference = "Third IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits",
address = "Anaheim, USA",
month = "November",
year = "2012",
editors = ""
}