3D-COSTAR: A Cost Model For 3D Stacked ICs
Publication Type | Conference Proceedings |
---|---|
Title | 3D-COSTAR: A Cost Model For 3D Stacked ICs |
Author(s) | M. Taouil S. Hamdioui E.J. Marinissen S Bhawmik |
Publication Date | November 2012 |
Conference Name | Third IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits |
Period | 8-9 November 2012 |
Location | Anaheim, USA |
ISBN | unknown |
Editor(s) | |
published | Published |
Selected Publication | No |
Note | |
Topic(s) | 3D Stacking |
Theme(s) | Dependable Nano Computing |
Project(s) | 3DIM3 |
Group(s) | Computer Engineering |
IEEE BibTex entry:
@proceedings{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen and S Bhawmik",
title = "3D-COSTAR: A Cost Model For 3D Stacked ICs",
conference = "Third IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits",
address = "Anaheim, USA",
month = "November",
year = "2012",
editors = ""
}
author = "M. Taouil and S. Hamdioui and E.J. Marinissen and S Bhawmik",
title = "3D-COSTAR: A Cost Model For 3D Stacked ICs",
conference = "Third IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits",
address = "Anaheim, USA",
month = "November",
year = "2012",
editors = ""
}