Computer Engineering Publications Database (2000-2018) Impact of Mid-Bond Testing in 3D Stacked ICs 
| Publication Type | Conference Paper |
|---|---|
| Title | Impact of Mid-Bond Testing in 3D Stacked ICs |
| Author(s) | M. Taouil S. Hamdioui E.J. Marinissen S Bhawmik |
| Publication Date | October 2013 |
| Conference Name | 16th IEEE Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems |
| Period | 2-4 October 2013 |
| Location | New York, USA |
| ISBN | 0 |
| Page Numbers | |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | 3D Stacking |
| Theme(s) | Dependable Nano Computing |
| Project(s) | 3DIM3 |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen and S Bhawmik",
title = "Impact of Mid-Bond Testing in 3D Stacked ICs",
booktitle = "Proc. 16th IEEE Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems",
address = "New York, USA",
month = "October",
year = "2013",
pages = ""
}
author = "M. Taouil and S. Hamdioui and E.J. Marinissen and S Bhawmik",
title = "Impact of Mid-Bond Testing in 3D Stacked ICs",
booktitle = "Proc. 16th IEEE Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems",
address = "New York, USA",
month = "October",
year = "2013",
pages = ""
}