Computer Engineering Publications Database (2000-2018) Impact of Test Flows on the Cost in 3D Die-to-Wafer Stacking 
| Publication Type | Conference Paper |
|---|---|
| Title | Impact of Test Flows on the Cost in 3D Die-to-Wafer Stacking |
| Author(s) | M. Taouil S. Hamdioui E.J. Marinissen |
| Publication Date | November 2010 |
| Conference Name | First IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits |
| Period | 4-5 November 2010 |
| Location | Austin, USA |
| ISBN | t.b.s. |
| Page Numbers | |
| published | Published |
| Selected Publication | No |
| Note | |
| Topic(s) | None |
| Theme(s) | None |
| Project(s) | None |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@inproceedings{,
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "Impact of Test Flows on the Cost in 3D Die-to-Wafer Stacking",
booktitle = "Proc. First IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits",
address = "Austin, USA",
month = "November",
year = "2010",
pages = ""
}
author = "M. Taouil and S. Hamdioui and E.J. Marinissen",
title = "Impact of Test Flows on the Cost in 3D Die-to-Wafer Stacking",
booktitle = "Proc. First IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits",
address = "Austin, USA",
month = "November",
year = "2010",
pages = ""
}