Computer Engineering Publications Database (2000-2018) Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost 
| Publication Type | Journal Paper |
|---|---|
| Title | Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost |
| Author(s) | M. Taouil S. Hamdioui C.I.M. Beenakker E.J. Marinissen |
| Publication Date | December 2011 |
| Journal Name | Journal of Electronic Testing: Theory and Applications |
| Volume | 28 |
| Issue | 1 |
| Page Numbers | 15-25 |
| ISSN | 0923-8174 |
| published | Published |
| Selected Publication | Yes |
| Note | |
| Topic(s) | None |
| Theme(s) | None |
| Project(s) | None |
| Group(s) | Computer Engineering |
IEEE BibTex entry:
@article{,
author = "M. Taouil and S. Hamdioui and C.I.M. Beenakker and E.J. Marinissen",
title = "Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost",
journal = "Journal of Electronic Testing: Theory and Applications",
volume = "28",
issue = "1",
month = "December",
year = "2011",
pages = "15-25"
}
author = "M. Taouil and S. Hamdioui and C.I.M. Beenakker and E.J. Marinissen",
title = "Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost",
journal = "Journal of Electronic Testing: Theory and Applications",
volume = "28",
issue = "1",
month = "December",
year = "2011",
pages = "15-25"
}