Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost 92_test_impact_on_the_overall_dietowafer_3d_stacked_ic_cost.pdf

Publication TypeJournal Paper
TitleTest Impact on the Overall Die-to-Wafer 3D Stacked IC Cost
Author(s)M. Taouil
S. Hamdioui
C.I.M. Beenakker
E.J. Marinissen
Publication DateDecember 2011
Journal NameJournal of Electronic Testing: Theory and Applications
Volume28
Issue1
Page Numbers15-25
ISSN0923-8174
publishedPublished
Selected PublicationYes
Note
Topic(s)None
Theme(s)None
Project(s)None
Group(s)Computer Engineering

IEEE BibTex entry:
@article{,
author = "M. Taouil and S. Hamdioui and C.I.M. Beenakker and E.J. Marinissen",
title = "Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost",
journal = "Journal of Electronic Testing: Theory and Applications",
volume = "28",
issue = "1",
month = "December",
year = "2011",
pages = "15-25"
}