M. Konijnenburg

NameM. Konijnenburg
First NameMario
E-mail
Author TypeExternal
Affiliation

Publications

E.J. Marinissen, C.C. Chi, J. Verbree, M. Konijnenburg, 3D DfT Architecture for Pre-Bond and Post-Bond Testing (November 2010), IEEE International Conference on 3D System Integration (3DIC 2010), 16-18 November 2010, Munich, Germany [Conference Paper]
E.J. Marinissen, J. Verbree, M. Konijnenburg, A structured and scalable test access architecture for TSV-based 3D stacked ICs (April 2010), 28th IEEE VLSI Test Symposium (VTS 2010), 19-22 April 2010, Santa Cruz, USA [Conference Paper]