M. Taouil, M. Masadeh, S. Hamdioui, E.J. Marinissen, Post-Bond Interconnect Test and Diagnosis for 3D Memory Stacked on Logic (May 2015), IEEE Transactions on Computers (TC), issue 99 [Journal Paper]

M. Taouil, M. Masadeh, S. Hamdioui, E.J. Marinissen, Interconnect Test for 3D Stacked Memory-on-Logic (March 2014), Design, Automation & Test in Europe (DATE 2014), 24-28 March 2014, Dresden, Germany [Conference Proceedings]

M. Masadeh, Interconnect Test for 3D Stacked Memories (August 2013), [Msc Thesis]