M. Lefter
Name | M. Lefter |
---|---|
First Name | Mihai |
M.Lefter@tudelft.nl | |
Author Type | Phd Student |
Affiliation | TU Delft |
Publications
M. Lefter, G.R. Voicu, T. Marconi, V. Savin, S.D. Cotofana,
LDPC-Based Adaptive Multi-Error Correction for 3D Memories
(September 2017),
35th IEEE International Conference on Computer Design (ICCD 2017), 5-8 November 2017, Boston, USA
[Conference Paper]
M. Lefter, T. Marconi, G.R. Voicu, S.D. Cotofana,
Low Cost Multi-Error Correction for 3D Polyhedral Memories
(July 2017),
IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH 2017), 25-26 July 2017, Newporrt, USA
[Conference Paper]
M. Enachescu, M. Lefter, G.R. Voicu, S.D. Cotofana,
Low-Leakage 3D Stacked Hybrid NEMFET-CMOS Dual Port Memory
(July 2016),
IEEE Transactions on Emerging Topics in Computing
, DOI: 10.1109/TETC.2016.2588725
[Journal Paper]
M. Lefter, G.R. Voicu, S.D. Cotofana,
A Shared Polyhedral Cache for 3D Wide-I/O Multi-Core Computing Platforms
(May 2015),
IEEE International Symposium on Circuits and Systems (ISCAS 2015), 24-27 May 2015, Lisbon, Portugal
[Conference Paper]
M. Lefter, M. Enachescu, G.R. Voicu, S.D. Cotofana,
Energy Effective 3D Stacked Hybrid NEMFET-CMOS Caches
(July 2014),
10th ACM/IEEE International Symposium on Nanoscale Architectures (NANOARCH 2014), 8-10 July 2014, Paris, France
[Conference Paper]
G.R. Voicu, M. Lefter, M. Enachescu, S.D. Cotofana,
3D Stacked Wide-Operand Adders: A Case Study
(June 2013),
24th IEEE International Conference on Application-Specific Systems, Architectures and Processors (ASAP 2013), 5-7 June 2013, Washington D.C., USA
[Conference Paper]
M. Enachescu, M. Lefter, A. Bazigos, A. Ionescu, S.D. Cotofana,
Ultra Low Power NEMFET Based Logic
(May 2013),
IEEE International Symposium on Circuits and Systems (ISCAS 2013), 19-23 May 2013, Beijing, China
[Conference Paper]
M. Lefter, G.R. Voicu, M. Taouil, M. Enachescu, S. Hamdioui, S.D. Cotofana,
Is TSV-based 3D Integration Suitable for Inter-die Memory Repair?
(March 2013),
Design, Automation & Test in Europe Conference & Exhibition (DATE 2013), 18-22 March 2013, Grenoble, France
[Conference Paper]
M. Taouil, M. Lefter, S. Hamdioui,
Exploring Test Opportunities for Memory and Interconnects in 3D ICs
(December 2012),
International Design & Test Symposium (IDT 2012), 15-17 December 2012, Doha, Qatar
[Conference Paper]
S. Safiruddin, M. Lefter, D. Borodin, G.R. Voicu, S.D. Cotofana,
Zero-Performance-Overhead Online Fault Detection and Diagnosis in 3D Stacked Integrated Circuits
(July 2012),
IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH 2012), 4-6 July 2012, Amsterdam, The Netherlands
[Conference Paper]
S. Safiruddin, D. Borodin, M. Lefter, G.R. Voicu, S.D. Cotofana,
Is 3D Integration The Way to Future Dependable Computing Platforms?
(May 2012),
13th International Conference on Optimization of Electrical and Electronic Equipment (OPTIM 2012), 24-26 May 2012, Brasov, Romania
[Conference Paper]